Laser-Flex
Sustainable, scalable manufacturing for flexible semiconductor devices.
Laser-Flex is a disruptive technology initiative developing sustainable, scalable manufacturing for flexible semiconductor devices. By combining particle-free (PF) copper (Cu) and zinc oxide (ZnO) inks with advanced laser-induced sintering, Laser-Flex aligns with the UK's National Semiconductor Strategy, enhancing sovereign capability and addressing supply chain vulnerabilities in advanced electronics.
Core Innovations
Particle-Free Copper Inks
Novel PF Cu inks replace expensive silver (~100× costlier), sintered in-situ by laser. Eliminates ovens, cuts curing times, and reduces material costs by up to 99% while enabling use on low-cost polymer substrates.
Particle-Free ZnO Inks
Abundant, non-toxic ZnO inks processed below 150°C. Achieves high carrier mobility (>5 cm²/V*s), supporting TFTs and sensors without complex lithography or vacuum systems.
Precision Manufacturing
This one-step digital laser manufacturing process enables precise printing of conductors and semiconductors with micron-scale resolution (<50 microns), simplifying device integration and accelerating production scalability.
Key Project Outputs
By enabling cost-effective, low-carbon, and recyclable silver-free FPE components, Laser-Flex supports the rapidly growing UK FPE market and the broader shift towards net-zero, circular electronics. This innovation is essential for sectors including wearables, MedTech, automotive, energy, and IoT.
Global semiconductor market value, with flexible electronics contributing $61B.
Projected UK flexible and printed electronics (FPE) market by 2025.
Reduction in material costs using Particle-Free Cu inks vs Silver.
Reduction in energy usage compared to traditional oven curing.